Impact of Chuck Temperature on Flicker Noise (1/f) Performance of PDSOI n-channel MOSFETs

S. Pathak, Asif Amin, P. Srinivasan, F. Guarín, A. Dixit
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Abstract

This paper reports the flicker noise (1/f) analysis of NFETs fabricated using a 45-nm partially depleted silicon on insulator (PDSOI) RFCMOS technology. The noise characterization and analysis are performed at different chuck temperatures down to −20 °C in linear region of operation. It has been found that the normalized drain current noise power spectral density increases with increasing temperature up to 120 °C. The carrier number fluctuation model has been used to successfully explain the measured 1/f noise at these temperatures. The trap densities extracted at gate overdrive voltage of 0.1 V and 0.15 V are found to increase with increasing temperature, as only electrically active traps within a few kT of the surface Fermi level (EF) contribute to 1/f noise. In addition, the frequency exponent γ is < 1 for all temperatures, which indicates non-uniform distribution of traps across the energy bandgap.
卡盘温度对PDSOI n沟道mosfet闪烁噪声(1/f)性能的影响
本文报道了采用45nm部分耗尽绝缘体上硅(PDSOI) RFCMOS技术制备的非场效应管的闪烁噪声(1/f)分析。噪声表征和分析在不同的卡盘温度下进行,温度低至- 20°C,线性运行区域。在120℃以下,归一化漏极电流噪声功率谱密度随温度升高而增大。利用载流子数波动模型成功地解释了在这些温度下测量到的1/f噪声。在栅极超驱动电压为0.1 V和0.15 V时提取的陷阱密度随着温度的升高而增加,因为只有在表面费米能级(EF)的几kT内的电活性陷阱才会产生1/f噪声。此外,频率指数γ在所有温度下都< 1,这表明陷阱在能量带隙中的分布不均匀。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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