Research on the factors affecting warpage of the light guide plate in the process of reliability

Abstract

This paper explores the influence factors of warpage of the light guide plate (LGP) by conducting the reliability experiments. The results show that the warpage of the LGP is mainly caused by uneven stress release under the thermal shock test (TST) condition, while the warpage of the LGP under the high temperature & humidity test (THS) condition is mainly caused by the interactive compression of LGP and the mold frame. The study provides a theoretical basis for the design of LGP in backlight module and can effectively reduce the incidence of warpage and deformation in the LGP.