Electrical characterization of partially insulated MOSFETs with buried insulators under source/drain regions

C. Oh, K. Yeo, Min Sang Kim, Chang-Sub Lee, D. Choi, Sung Hwan Kim, S. Lee, Sung-min Kim, Jung-dong Choe, Yong Kyu Lee, E. Yoon, Ming Li, S. Suk, Dong-Won Kim, Donggun Park, Kinam Kim
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引用次数: 6

Abstract

In this article, we evaluated the structural merits of a partially insulated MOSFET (PiFET), for ultimate scaling of planar MOSFETs, through simulation and fabrication. The newly fabricated PiFET showed outstanding short channel effect (SCE) immunity and off-current characteristics over the conventional MOSFET, resulting from a self-induced halo region, self-limiting S/D shallow junction, and reduced junction area due to PiOX layer formation. Thus, the PiFET can be an attractive alternative for ultimate scaling of planar MOSFETs.
源/漏区埋地绝缘体部分绝缘mosfet的电学特性
在本文中,我们通过模拟和制造评估了部分绝缘MOSFET (PiFET)的结构优点,用于平面MOSFET的最终缩放。与传统的MOSFET相比,新制造的PiFET具有出色的短沟道效应(SCE)抗扰度和断流特性,这是由于自诱导晕区,自限S/D浅结以及由于PiOX层形成而减小的结面积。因此,PiFET可以成为平面mosfet的最终缩放的有吸引力的替代方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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