Temperature vs. Reliability for Hardened Systems in Substations

Abstract

Electronics cooling is getting increased attention as intelligent systems integrating higher-density components migrate into industrial settings. Product designs need to adapt to harsher conditions than the traditional office environments. Available component temperature ratings are rising, but factors such as component high-heat generation and device packaging density are leading to higher-temperature operating conditions, thus offsetting the gains in heat immunity. This paper evaluates thermal design trade-offs related to reliability and offers some insights worth considering in the design and deployment of industrial systems.