Automated WLR testing of HBT's

Abstract

This paper describes how a standard probing system was modified to allow automated wafer level reliability (WLR) testing of heterojunction bipolar transistors (HBT's). It discusses how the thermally induced chuck movement was compensated for using a program written in LabView software. It also discusses how to set up gravity probes to allow wafer movement while keeping the needles on the pads. The paper then presents the emitter resistance result from Gummel plots obtained with the automated HBT tester.