Transmission line analysis of MCM interconnects

Abstract

The transmission line behavior of MCM-D interconnection lines is discussed with particular emphasis on the frequency dependent loss and delay characteristics. A broadband model covering the frequency spectrum from DC to RF is proposed. The applicability of this model is experimentally verified by comparison with measured S-parameters from 45 MHz to 18 GHz on test structures realized with two different MCM-D technologies. The broadband model is integrated in the time-domain network simulator TRANSPLUS. This program was developed for the simulation of the interconnection circuitry between chips, it thus includes models for the output circuits of the chips, the packaging, and the (coupled) interconnection lines. Simulations of different MCM-D interconnections between CMOS and bipolar chips are discussed.<>