Eigen-signatures for regularity-based IDDQ testing

Y. Okuda
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引用次数: 9

Abstract

Researchers and test engineers challenge I/sub DDQ/ testing on deep submicron (DSM) devices. We have proposed to test devices with high I/sub DDQ/ currents at normal operating conditions based on exploiting the regularity of defect-free I/sub DDQ/ signatures, the I/sub DDQ/ responses of a circuit on a test vector set. This paper demonstrates the fundamental characteristics of the regularity and proposes a new methodology based on eigen-signatures. Eigen-signatures are unique signatures transformed from I/sub DDQ/ signatures. The analysis of five eigen-signatures, including enhanced "Delta I/sub DDQ/" and "Current Ratios," on a product indicates that: the I/sub DDQ/ values related to a test vector set have a small variation, whereas, the I/sub DDQ/ magnitudes have a large variation; and the defect current prediction error of methods focusing the changes between the test vectors is 23 times smaller than the error of methods focusing the I/sub DDQ/ magnitudes.
基于规则的IDDQ测试的特征签名
研究人员和测试工程师对深亚微米(DSM)器件的I/sub DDQ/测试提出了挑战。我们提出了在正常工作条件下测试具有高I/sub DDQ/电流的器件,基于利用无缺陷I/sub DDQ/特征的规律性,测试向量集上电路的I/sub DDQ/响应。本文论证了正则性的基本特征,提出了一种基于特征签名的新方法。特征签名是由I/sub DDQ/签名转换而来的唯一签名。对一个产品的五个特征特征(包括增强的“δ I/sub DDQ/”和“电流比”)的分析表明:与测试向量集相关的I/sub DDQ/值变化很小,而I/sub DDQ/幅度变化很大;聚焦测试矢量间变化的缺陷电流预测误差比聚焦I/sub DDQ/震级的缺陷电流预测误差小23倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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