A SP9T cellular antenna switch in 2.5 V CMOS thin-film SOI

V. Blaschke, A. Unikovski, P. Hurwitz, S. Chaudhry
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引用次数: 12

Abstract

This paper presents the results of a compact wire-bond SP9T antenna switch that was designed as technology demonstrator for a 2.5 V CMOS, 250 fs Ron-Coff thin-film SOI process. Through “layout-driven” circuit design, a small die size of 1.52 mm2 was achieved for a fully integrated switch die containing RF-section I/O pads, ESD, decoder, level shifters and dual frequency charge pump to generate negative vss. The dual frequency charge pump was a requirement to achieve a fast start-up time of 10 μs and switch rise times of 3 μs. A low insertion loss of 0.42 dB for cellular low-band at 915 MHz and 0.55 dB for cellular high-band at 1910 MHz, harmonic powers better -76 dBc over battery and Band I/V IMD3 of -110 dBm were achieved. All ports show a high ESD tolerance of 2 kV HBM.
SP9T蜂窝天线开关在2.5 V CMOS薄膜SOI
本文介绍了一种紧凑的线键合SP9T天线开关的设计结果,该开关被设计为2.5 V CMOS, 250 fs Ron-Coff薄膜SOI工艺的技术演示。通过“布局驱动”电路设计,实现了一个包含rf段I/O衬底、ESD、解码器、电平移位器和双频电荷泵的全集成开关芯片的小芯片尺寸为1.52 mm2,以产生负vss。双频充电泵需要实现10 μs的快速启动时间和3 μs的开关上升时间。在915 MHz时,蜂窝低频段的插入损耗为0.42 dB,在1910 MHz时,蜂窝高频段的插入损耗为0.55 dB,谐波功率优于电池-76 dBc,频带I/V IMD3为-110 dBm。所有端口都具有2 kV HBM的高ESD容忍度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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