What does the customer expect from a perfectly designed and manufactured PQFP package?

A.A. Shinohara
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引用次数: 1

Abstract

It is pointed out that customers of semiconductor packaged devices have strongly requested new, advanced SMDs which meet their requirements. Semiconductor manufacturers have made great efforts to develop and manufacture new semiconductor packages. They have endeavored to satisfy even unreasonable demands. The main reasons for the ability of Japanese semiconductor manufacturers to continue as they do now are described. In addition, mismatches of PQFP (plastic quad flat pack) package design between the Electronics Industry Association in Japan and the Joint Electronics Devices Engineering Council are considered. It is noted that the current situation cannot be considered desirable from a standardization point of view.<>
客户对完美设计和制造的PQFP封装的期望是什么?
指出半导体封装器件的客户强烈要求新的、先进的贴片,以满足他们的要求。半导体制造商在开发和制造新的半导体封装方面做出了巨大的努力。他们甚至尽力满足不合理的要求。描述了日本半导体制造商能够继续像现在这样做的主要原因。此外,还考虑了日本电子工业协会和联合电子设备工程委员会之间PQFP(塑料四平面封装)封装设计的不匹配。有人指出,从标准化的角度来看,目前的情况是不可取的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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