{"title":"Design considerations of vacuum-sealed OCXO's for high reliability applications","authors":"R. Clark, A. Scalpi","doi":"10.1109/FREQ.1996.559898","DOIUrl":null,"url":null,"abstract":"It is well known that the use of a vacuum sealed enclosure which contains the crystal and oscillator circuitry can be of significant value in enhancing the performance of OCXO's. This paper reports on the design of a new vacuum sealed OCXO termed the EMXO having the design objectives of (1) a design which allows for the use of several different crystal enclosures, including the standard TO-8, (2) a parts count reduction of approximately 50% over previous designs and (3) a provision to utilize high reliability components such as class \"S\" on ceramic construction. The resulting oven thermal resistance measured approximately 180/spl deg/C/W thereby yielding a steady state power dissipation of less than 1 W at -55/spl deg/C.","PeriodicalId":140391,"journal":{"name":"Proceedings of 1996 IEEE International Frequency Control Symposium","volume":"1986 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1996 IEEE International Frequency Control Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/FREQ.1996.559898","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
It is well known that the use of a vacuum sealed enclosure which contains the crystal and oscillator circuitry can be of significant value in enhancing the performance of OCXO's. This paper reports on the design of a new vacuum sealed OCXO termed the EMXO having the design objectives of (1) a design which allows for the use of several different crystal enclosures, including the standard TO-8, (2) a parts count reduction of approximately 50% over previous designs and (3) a provision to utilize high reliability components such as class "S" on ceramic construction. The resulting oven thermal resistance measured approximately 180/spl deg/C/W thereby yielding a steady state power dissipation of less than 1 W at -55/spl deg/C.