Accurate interconnect modeling: Towards multi-million transistor chips as microwave circuits

N. V. D. Meijs, T. Smedes
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引用次数: 10

Abstract

In this paper we discuss concepts and techniques for the accurate and efficient modeling and extraction of interconnect parasitics in VLSI designs. Due to increasing operating frequencies, microwave-like effects will become important. Therefore stronger demands are put on extraction and verification tools. We indicate the state-of-the-art for capacitance, resistance and substrate resistance extraction and discuss some open problems. We also discuss several model reduction techniques as well as issues related to simulation and implementation in a CAD system.
精确互连建模:面向数百万晶体管芯片作为微波电路
本文讨论了在超大规模集成电路设计中准确有效地建模和提取互连寄生的概念和技术。由于工作频率的增加,类微波效应将变得重要。因此,对提取和验证工具提出了更高的要求。我们指出电容、电阻和衬底电阻提取的现状,并讨论了一些有待解决的问题。我们还讨论了几种模型简化技术以及与CAD系统中的仿真和实现相关的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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