Predicting future technology performance

A. Asenov, C. Alexander, C. Riddet, E. Towie
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引用次数: 9

Abstract

In this paper we highlight the important role of full-scale 3D Ensemble Monte Carlo (EMC) transport simulations in the performance analysis of contemporary and future decananometer MOSFETs. Considering both electron and hole transport in alternative device structures and materials we demonstrate that conventional drift diffusion (DD) simulations using standard mobility models fail to capture the non-equilibrium transport effects present in these devices, limiting their effectiveness in terms of performing predictive simulation of Si based FinFETs. We clearly demonstrate the capabilities and the power of EMC in evaluating the scaling potential and performance of FinFETs and quantum well transistors employing high mobility materials and the impact that additional scattering sources has on their performance.
预测未来技术性能
在本文中,我们强调了全尺寸三维集成蒙特卡罗(EMC)输运模拟在当代和未来十安计mosfet的性能分析中的重要作用。考虑到替代器件结构和材料中的电子和空穴输运,我们证明了使用标准迁移率模型的传统漂移扩散(DD)模拟无法捕获这些器件中存在的非平衡输运效应,从而限制了它们在执行Si基finfet预测模拟方面的有效性。我们清楚地展示了EMC在评估采用高迁移率材料的finfet和量子阱晶体管的缩放潜力和性能以及附加散射源对其性能的影响方面的能力和力量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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