{"title":"Evaluation of effectiveness of median of absolute deviations outlier rejection-based I/sub DDQ/ testing for burn-in reduction","authors":"S. Sabade, D. Walker","doi":"10.1109/VTS.2002.1011115","DOIUrl":null,"url":null,"abstract":"CMOS chips having high leakage are observed to have high burn-in fallout rate. I/sub DDQ/ testing has been considered as an alternative to burn-in. However, increased subthreshold leakage current in deep submicron technologies limits the use of I/sub DDQ/ testing in its present form. In this work, a statistical outlier rejection technique known as the median of absolute deviations (MAD) is evaluated as a means to screen early failures using I/sub DDQ/ data. MAD is compared with delta I/sub DDQ/ and current signature methods. The results of the analysis of the SEMATECH data are presented.","PeriodicalId":237007,"journal":{"name":"Proceedings 20th IEEE VLSI Test Symposium (VTS 2002)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"39","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 20th IEEE VLSI Test Symposium (VTS 2002)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTS.2002.1011115","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 39
Abstract
CMOS chips having high leakage are observed to have high burn-in fallout rate. I/sub DDQ/ testing has been considered as an alternative to burn-in. However, increased subthreshold leakage current in deep submicron technologies limits the use of I/sub DDQ/ testing in its present form. In this work, a statistical outlier rejection technique known as the median of absolute deviations (MAD) is evaluated as a means to screen early failures using I/sub DDQ/ data. MAD is compared with delta I/sub DDQ/ and current signature methods. The results of the analysis of the SEMATECH data are presented.