{"title":"2.5 Gbps Infiniband copper cable interconnect compliance","authors":"I. Birkeli","doi":"10.1109/EPEP.2004.1407548","DOIUrl":null,"url":null,"abstract":"This work puts a focus on the problems facing a board designer when implementing 2.5 Gbps Infiniband board to board electrical interconnect via a copper cable. To be compliant to specification, in low-cost, high volume packaging, using standard FR4 PCB technology, may be a great challenge.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407548","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This work puts a focus on the problems facing a board designer when implementing 2.5 Gbps Infiniband board to board electrical interconnect via a copper cable. To be compliant to specification, in low-cost, high volume packaging, using standard FR4 PCB technology, may be a great challenge.