TCAD Evaluation of the Substrate Bias Influence on the Carrier Transport of Ω-Gate Nanowire MOS Transistors with Ultra-Thin BOX

F. Bergamaschi, M. Pavanello
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引用次数: 1

Abstract

In this work, the effects of substrate biasing on the electrical behavior of n-type Ω-gate SOI nanowire MOS transistors with thin buried oxide (BOX) and variable fin width are analyzed. The analysis is carried over through 3D TCAD simulations calibrated with experimental data. Mobility degradation is observed for negative back bias due to surface-related scattering mechanisms on the front gate channel, while mobility increase is verified for positive back bias values that induce conduction in both front and back channels. High back bias values, however, which activate the back channel prior to the front one, lead to degradation in carrier mobility. On-state-off-state current ratio reduces for positive back bias due to degradation in the subthreshold slope, while DIBL is worsened due to the reduced front gate control when the substrate’s positive electric field takes ahold of the inversion charges.
衬底偏压对Ω-Gate超薄盒纳米线MOS晶体管载流子输运影响的TCAD评估
本文分析了衬底偏置对具有薄埋氧化物(BOX)和可变翅片宽度的n型Ω-gate SOI纳米线MOS晶体管电学行为的影响。分析通过三维TCAD模拟与实验数据校准进行。由于正门通道上表面相关的散射机制,观察到负背偏压的迁移率下降,而正门偏置值在正门通道和正门通道诱导传导时,迁移率增加。然而,高的后偏置值会在前通道之前激活后通道,从而导致载流子迁移率的降低。由于亚阈值斜率的降低,正偏置的通断电流比降低,而当衬底的正电场控制反转电荷时,由于前门控制减少,DIBL恶化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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