Advanced Process Monitoring through Fault Detection and Classification for Robust Statistical Process Control of Tantalum Nitride Reactive Sputtering

Abstract

This paper discusses Fault Detection and Classification (FDC) deployed in high-volume manufacturing for the Tantalum Nitride (TaN) reactive sputtering process. TaN thin film resistors (TFR) with an average sheet resistance (Rs) of 50 ohms/sq with high uniformity and negative temperature coefficient of resistance (TCR) were achieved. Optimizing interdiction capabilities for real-time prevention and detection of parameter excursions strengthened statistical process control (SPC) and improved yield.