A wideband model for high density ball-grid array packages for very high speed digital circuits

Abstract

This paper presents an efficient method for modeling of interconnecting circuit in Super Ball Grid Array (SBGA) packages. The model is based on physical segmentation and electromagnetic (EM) analysis of each segment. An equivalent circuit model based on EM analysis is developed for each segment and connecting individual segment models completes the final model. For verification and calibration the scattering parameters of the resulting model is first compared with EM analysis of important substructure and also with experimental data from a test package. Initial results show good agreement with measurement up to 15GHz‥