Vertical CBRAM (V-CBRAM): From Experimental Data to Design Perspectives

G. Piccolboni, M. Parise, G. Molas, A. Levisse, J. Portal, R. Coquand, C. Carabasse, M. Bernard, A. Roule, J. Noel, B. Giraud, M. Harrand, C. Cagli, T. Magis, E. Vianello, B. De Salvo, G. Ghibaudo, L. Perniola
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引用次数: 6

Abstract

In this paper, we propose the integration of an Al2O3/CuTex based Conductive Bridge RAM (CBRAM) device in vertical configuration. The performances of the memory devices are evaluated. 20ns switching time, up to 106 cycles and stable 150°C retention were demonstrated. Functionality is compared with Vertical RRAM integrating an HfO2/Ti OXRAM stack, showing the pros and cons of each configuration. Then 2 potential applications are discussed using design approach. For high density, the Vertical RRAM cell features and circuit are dimensioned to optimize the memory page density. Finally, for neuromorphic applications, selector and array configuration are tuned to reduce the variability in terms of voltage seen by each cell constituting a vertical synapse.
垂直CBRAM (V-CBRAM):从实验数据到设计视角
在本文中,我们提出了在垂直配置中集成基于Al2O3/CuTex的导电桥式RAM (CBRAM)器件。对存储器件的性能进行了评价。20ns的开关时间,高达106个循环和稳定的150°C保持证明。将功能与集成HfO2/Ti OXRAM堆栈的垂直RRAM进行比较,显示每种配置的优点和缺点。然后用设计方法讨论了两种潜在的应用。在高密度情况下,对垂直RRAM单元特征和电路进行了量纲化,以优化内存页面密度。最后,对于神经形态应用,选择器和阵列配置被调优,以减少每个构成垂直突触的细胞所看到的电压的可变性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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