Thermal properties of graphene and few-layer graphene: applications in electronics

Zhong Yan, D. Nika, A. Balandin
{"title":"Thermal properties of graphene and few-layer graphene: applications in electronics","authors":"Zhong Yan, D. Nika, A. Balandin","doi":"10.1049/iet-cds.2014.0093","DOIUrl":null,"url":null,"abstract":"The authors review thermal properties of graphene and few-layer graphene (FLG), and discuss applications of these materials in thermal management of advanced electronics. The intrinsic thermal conductivity of graphene - among the highest of known materials - is dominated by phonons near the room temperature. The examples of thermal management applications include the FLG heat spreaders integrated near the heat generating areas of the high-power density transistors. It has been demonstrated that FLG heat spreaders can lower the hot-spot temperature during device operation, resulting in improved performance and reliability of the devices.","PeriodicalId":120076,"journal":{"name":"IET Circuits Devices Syst.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2015-01-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"90","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Circuits Devices Syst.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1049/iet-cds.2014.0093","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 90

Abstract

The authors review thermal properties of graphene and few-layer graphene (FLG), and discuss applications of these materials in thermal management of advanced electronics. The intrinsic thermal conductivity of graphene - among the highest of known materials - is dominated by phonons near the room temperature. The examples of thermal management applications include the FLG heat spreaders integrated near the heat generating areas of the high-power density transistors. It has been demonstrated that FLG heat spreaders can lower the hot-spot temperature during device operation, resulting in improved performance and reliability of the devices.
石墨烯和少层石墨烯的热性能:在电子学中的应用
综述了石墨烯和少层石墨烯(FLG)的热性能,并讨论了这些材料在先进电子器件热管理中的应用。石墨烯的固有热导率是已知材料中最高的,在室温附近由声子主导。热管理应用的例子包括集成在高功率密度晶体管发热区附近的FLG散热片。研究表明,FLG散热片可以降低器件运行过程中的热点温度,从而提高器件的性能和可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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