K. Yoshikawa, T. Koga, T. Fujii, T. Katoh, Y. Takahashi, Y. Seki
{"title":"A novel IGBT chip design concept of high turn-off current capability and high short circuit capability for 2.5 kV power pack IGBT","authors":"K. Yoshikawa, T. Koga, T. Fujii, T. Katoh, Y. Takahashi, Y. Seki","doi":"10.1109/ISPSD.1999.764091","DOIUrl":null,"url":null,"abstract":"A novel concept for achieving high electrical withstand capability on a high power IGBT is discussed in this paper. It should be noted that high turn-off capability of 6600 amperes (at peak collector voltage=2500 V, T/sub j/=125/spl deg/C) and the short circuit capability of over 50 /spl mu/s (at V/sub CC/=1600 V, T/sub j/=125/spl deg/C) are successfully attained by a newly developed power pack IGBT. In this paper, simulation results based upon the novel design concept are presented. Furthermore, experimental results are demonstrated to corroborate the simulation results.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1999.764091","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A novel concept for achieving high electrical withstand capability on a high power IGBT is discussed in this paper. It should be noted that high turn-off capability of 6600 amperes (at peak collector voltage=2500 V, T/sub j/=125/spl deg/C) and the short circuit capability of over 50 /spl mu/s (at V/sub CC/=1600 V, T/sub j/=125/spl deg/C) are successfully attained by a newly developed power pack IGBT. In this paper, simulation results based upon the novel design concept are presented. Furthermore, experimental results are demonstrated to corroborate the simulation results.