Barbed spike arrays for mechanical chip attachment

P. Griss, P. Enoksson, G. Stemme
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引用次数: 13

Abstract

We fabricated and tested two types of microstructures for the mechanical attachment of chips to soft surfaces. The microstructures are barbed spikes etched in silicon using DRIE (Deep Reactive Ion Etching). The mechanical attachment of two types of barbed spike arrays was measured on nonbiological materials (Polyethylene foil, Aluminium foil and Parafilm/sup TM/) as well as on human skin. The maximum adhesion force was 1,36 N achieved by a 2/spl times/2 mm/sup 2/ chip containing 64 barbed spikes pressed in Polyethylene foil. Maximum adhesion in skin was 0,54 N. The shape of the two different barb types has significant influence on the detachment forces for nonbiological materials.
用于机械芯片连接的倒刺刺阵列
我们制造并测试了两种类型的微结构,用于芯片在软表面的机械附着。微结构是用DRIE(深度反应离子蚀刻)在硅上蚀刻的倒刺尖刺。测量了两种刺刺阵列在非生物材料(聚乙烯箔、铝箔和Parafilm/sup TM/)以及人体皮肤上的机械附着。最大附着力为1.36 N,由2/spl倍/2 mm/sup 2/片,包含64个倒刺钉压在聚乙烯箔上。两种不同类型倒刺的形状对非生物材料的脱离力有显著影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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