Electrothermal simulation of Resistive Random Access Memory(RRAM) array using finite difference method

Yandong Luo, Wenchao Chen, M. Cheng, Kai Kang, W. Yin
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引用次数: 1

Abstract

Memory is very important in the present era of Internet of Thing (IoT) and Big Data, while Resistive Random Access Memory (RRAM) is a key member in the family of non-volatile memory. However, in the development of high density RRAM memory array, self-heat effect (SHE) as well as thermal crosstalk must be understood and controlled during its operation. In this paper, simulation of electrothermal effects in both single RRAM cell and 3×3×3 array are performed using our in-house developed algorithm, which is validated in comparison with that of commercial software COMSOL. Further on, hybrid effects of different geometrical and material parameters on the memory performance are characterized and addressed.
电阻式随机存取存储器(RRAM)阵列的有限差分电热模拟
在物联网(IoT)和大数据时代,存储器非常重要,而电阻式随机存取存储器(RRAM)是非易失性存储器家族的关键成员。然而,在高密度随机存储器阵列的发展过程中,必须了解和控制自热效应和热串扰。本文采用自主开发的算法对单个RRAM单元和3×3×3阵列中的电热效应进行了模拟,并与商业软件COMSOL进行了对比验证。进一步,研究了不同几何参数和材料参数对记忆性能的混合效应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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