Investigation of thermal effects in β-Ga2O3 MOSFET using pulsed IV

N. Moser, A. Crespo, S. Tetlak, A. Green, K. Chabak, G. Jessen
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引用次数: 2

Abstract

Recently, β-Ga2O3 FETs have been introduced [1]-[3] as potential devices for high power, switching, and RF applications with increased performance and more cost effective means of production when compared to GaN or SiC. Documented material properties leading to a Baliga [4] figure of merit nearly four times that of GaN [1], indicate potential for reduced specific on resistance at higher breakdown voltages if theoretical material characteristics can be exploited. To achieve projections, however, low thermal conductivity of ~13 W/mK [5] [6], less than a tenth of GaN or SiC [7], must be managed. We present electrical characterization for ß-Ga2O3 MOSFETs using both static and pulsed measurement systems. Our results show the extent of thermal effects and provide a basis for developing test protocols to effectively characterize the devices without inducing thermal effects or degradation.
利用脉冲IV研究β-Ga2O3 MOSFET的热效应
最近,β-Ga2O3 fet被引入[1]-[3],作为高功率、开关和射频应用的潜在器件,与GaN或SiC相比,具有更高的性能和更低的成本效益。记录的材料特性导致Baliga[4]的优值几乎是GaN[1]的四倍,表明如果可以利用理论材料特性,则在更高击穿电压下降低比电阻的潜力。然而,为了实现预测,必须控制低导热系数~13 W/mK[5][6],低于GaN或SiC[7]的十分之一。我们使用静态和脉冲测量系统对ß-Ga2O3 mosfet进行电学表征。我们的结果显示了热效应的程度,并为开发测试方案提供了基础,以有效地表征器件而不会引起热效应或退化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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