Challenges and Solutions for 3D Fabric: A Foundry Perspective

Abstract

3D ICs have increasingly become popular as they provide a way to pack more functionality on a chip and reduce manufacturing cost. TSMC offers a number of packaging technologies under the umbrella of "3D Fabric" to suit different product requirements. Just like any new technology, 3D Fabric brings forward several challenges associated with system, design, thermal as well as testing that require effective and efficient solutions before 3D Fabric can be used in high volume production. In this presentation, we will give a brief introduction about various 3D Fabric offerings and discuss challenges from a semiconductor foundry perspective. Next, we present an overview of solutions along with what EDA needs to solve. Lastly, how various IEEE Standards such as 1838, and 1149.1 can help in streamlining and standardizing testing approaches for 3D Fabrics will be discussed.