Thermal characterization of plastic and ceramic surface-mount packages

Abstract

Summary form only given. The thermal performance of devices packaged with 28-, 44-, 68-, and 84-lead versions of the industry-standard plastic leaded chip carrier (PLCC) and also with 68-, 84-, 100-, and 124-lead plastic and ceramic flatpack components (PFP and CFP, respectively), are considered. Experimental data collected in both natural and forced convection conditions for individual components, surface mounted to small sections of epoxy circuit cards, are noted. The test vehicles were vertically mounted in separate rectangular channels and positioned to experience hydrodynamically developing flow. A custom thermal chip was used to both simulate device power and sense bulk chip temperature. Average air velocity and chip power dissipation were the primary independent test variables, ranging from 0 to 3 m/s and 0.2 to 2.0 W, respectively.<>