Partial etched AlGaN layer on p-GaN HEMT with gate field plate and drain field plate for channel temperature reduction

Abstract

Self-heating effect of gallium nitride high electron mobility transistors (GaN HEMTs) has been a serious problem owing to their high-power and high-frequency operations, thus the method to optimize temperature was studied. In this work, the 2D temperature distribution model of p-GaN HEMT which has gate field plate and drain field plate is presented. Successively, etching AlGaN layer changes the two-dimensional electron gas (2DEG) density and the interface electric field between AlGaN layer and GaN buffer. The quantitative analysis of the etched region parameters which include etching length and etching depth were simulated systematically by using simulation software. The results show that etching AlGaN layer is helpful to reduce the peak temperature of active region and increase off-state breakdown voltage．