High-speed optoelectronic packaging

Abstract

The demand for greater bandwidth has stimulated the increased integration of optical and electrical devices in optoelectronic modules. In many cases the new components require high-speed electrical interconnect and effective thermal management solutions. Assembly automation is seen as a requirement to achieve cost-effective solutions. All of this leads to the need for new optoelectronic packaging technologies. At high signal rates all electrical transitions must be treated as active parts of the electrical circuit - the package can no longer be designed in isolation. This presentation describes various aspects of optoelectronic packaging and shows the potential solutions developed by package suppliers.