Xing Wang, S. Kabir, J. Weber, S. Dvorak, J. Prince
{"title":"Field analysis in inhomogeneously-filled stripline circuits","authors":"Xing Wang, S. Kabir, J. Weber, S. Dvorak, J. Prince","doi":"10.1109/EPEP.2001.967635","DOIUrl":null,"url":null,"abstract":"The electric field is analyzed in a three-dimensional, inhomogeneously-filled stripline structure. The spectral domain technique is first used to obtain the field expressions in the spectral domain. Analytically performing the two-dimensional inverse Fourier transform results in electric fields that are expressed as closed-form solutions in terms of special functions that are free from any numerical integration. The closed-form solutions permit efficient, accurate full-wave simulations for packaging structures. Computational results for the fields are presented and the physical phenomenology of the fields is studied.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967635","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The electric field is analyzed in a three-dimensional, inhomogeneously-filled stripline structure. The spectral domain technique is first used to obtain the field expressions in the spectral domain. Analytically performing the two-dimensional inverse Fourier transform results in electric fields that are expressed as closed-form solutions in terms of special functions that are free from any numerical integration. The closed-form solutions permit efficient, accurate full-wave simulations for packaging structures. Computational results for the fields are presented and the physical phenomenology of the fields is studied.