A 5-GHz Injection-Locked Delay Cell with 10–25 ns Adjustable Group-Delay in a 130-nm SiGe BiCMOS Technology

A. Nazhad, A. Alizadeh, Milad Frounchi, J. Cressler, B. Bakkaloglu, S. Kiaei
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Abstract

This paper presents an on-chip delay line (DL) unit with an adjustable group delay (GD) between 10 and 25 ns. This active DL is designed based on an injection locked voltage-controlled oscillator (ILVCO) topology, with operation frequency of 5 GHz. Analog GD tuning is achieved through the control voltage of the VCO and the power of the injected signal. The free running phase noise of the DL at 100 KHz and 10 MHz offsets are − 98 and −140 dBc/Hz, respectively, and follows the phase noise of the injected signal in its locked mode. The DL was implemented in a 130-nm SiGe BiCMOS platform, and consumes 1.26 mm2 of silicon area. The power dissipation of the VCO core and buffer stage are 1.68 and 17.7 mW, respectively. To the authors best knowledge, the achieved GD is among the best.
基于130纳米SiGe BiCMOS技术的10 - 25ns可调群延迟的5ghz注入锁定延迟单元
本文提出了一种片上延迟线(DL)单元,其群延迟(GD)在10 ~ 25ns之间可调。该有源DL是基于注入锁定压控振荡器(ILVCO)拓扑设计的,工作频率为5 GHz。模拟GD调谐是通过控制压控振荡器的电压和注入信号的功率实现的。DL在100khz和10mhz偏置时的自由运行相位噪声分别为- 98和- 140 dBc/Hz,并且跟随注入信号在锁定模式下的相位噪声。DL在130纳米SiGe BiCMOS平台上实现,消耗1.26 mm2的硅面积。VCO核心和缓冲级的功耗分别为1.68和17.7 mW。据作者所知,实现的GD是最好的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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