Double sided flexible carrier with discretes and thermally enhanced FCA/COF

Abstract

This paper describes an electronic assembly that uses SMT components, wire bonded chips as well as area array chips attached to a flexible carrier. The wire bond chip is reworkable until encapsulation. Heat spreaders are attached to flip chips and wire bond chips with thermally conductive adhesives. Volume constraints imposed by a system design can he satisfied by populating both sides of a flexible carrier with components. Potential cost savings and reliability gains are possible with this electronic assembly design. A single flexible carrier with chips can replace multiple printed circuit cards and two levels of interconnection.<>