Electrical insulation properties of the polyimide prepared by VDPM

Abstract

The polyimide thin films, which are synthesized with pyromellitic dianhydride (PMDA) and 4,4'-diaminodiphenyl ether (DDE), are fabricated by the vapor deposition polymerized method of dry processes. In order to analyze the characteristics required for inter-layer insulation films of semiconductor devices, the molecular structure and uniformity, the variation of the internal composition element, the permeation depth of the upper electrode, and the breakdown strength are experimentally investigated.