Demonstration of p-type In0.7Ga0.3As/GaAs0.35Sb0.65 and n-type GaAs0.4Sb0.6/In0.65Ga0.35As complimentary Heterojunction Vertical Tunnel FETs for ultra-low power logic

R. Pandey, H. Madan, H. Liu, V. Chobpattana, M. Barth, B. Rajamohanan, M. Hollander, T. Clark, K. Wang, J-H Kim, D. Gundlach, K. Cheung, J. Suehle, R. Engel-Herbert, S. Stemmer, S. Datta
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引用次数: 38

Abstract

Extremely scaled high-k gate dielectrics with high quality electrical interfaces with arsenide (As) and antimonide (Sb) channels are used to demonstrate complimentary `all III-V' Heterojunction Vertical Tunnel FET (HVTFET) with record performance at |VDS|=0.5V. The p-type TFET (PTFET) has ION =30μA/μm and ION/IOFF =105, whereas the n-type TFET (NTFET) has ION =275μA/μm and ION/IOFF=3×105, respectively. NTFET shows 55mV/decade switching slope (SS) while PTFET shows 115mV/decade SS in pulsed mode measurement. Vertical TFET offers 77% higher effective drive strength than Si-FinFET for given inverter standard cell area. Energy-delay performance of TFET shows gain over CMOS for low VDD logic applications.
用于超低功耗逻辑的p型In0.7Ga0.3As/GaAs0.35Sb0.65和n型GaAs0.4Sb0.6/In0.65Ga0.35As互补异质结垂直隧道场效应管的演示
使用具有砷化(As)和锑化(Sb)通道的高质量电接口的极尺度高k栅极介电体来演示互补的“全III-V”异质结垂直隧道FET (HVTFET),其在|VDS|=0.5V时具有创纪录的性能。p型TFET (PTFET)的离子强度为30μA/μm,离子/IOFF= 105, n型TFET (NTFET)的离子强度为275μA/μm,离子/IOFF=3×105。在脉冲模式下,NTFET显示55mV/ 10年的开关斜率(SS),而PTFET显示115mV/ 10年的开关斜率。在给定的逆变器标准电池面积下,垂直TFET的有效驱动强度比Si-FinFET高77%。在低VDD逻辑应用中,TFET的能量延迟性能显示出优于CMOS的增益。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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