High performance digital read out integrated circuit (DROIC) for infrared imaging

Genki Mizuno, R. Oláh, Patrick Oduor, A. Dutta, N. Dhar
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引用次数: 5

Abstract

Banpil Photonics has developed a high-performance Digital Read-Out Integrated Circuit (DROIC) for image sensors and camera systems targeting various military, industrial and commercial Infrared (IR) imaging applications. The on-chip digitization of the pixel output eliminates the necessity for an external analog-to-digital converter (ADC), which not only cuts costs, but also enables miniaturization of packaging to achieve SWaP-C camera systems. In addition, the DROIC offers new opportunities for greater on-chip processing intelligence that are not possible in conventional analog ROICs prevalent today. Conventional ROICs, which typically can enhance only one high performance attribute such as frame rate, power consumption or noise level, fail when simultaneously targeting the most aggressive performance requirements demanded in imaging applications today. Additionally, scaling analog readout circuits to meet such requirements leads to expensive, high-power consumption with large and complex systems that are untenable in the trend towards SWaP-C. We present the implementation of a VGA format (640x512 pixels 15μm pitch) capacitivetransimpedance amplifier (CTIA) DROIC architecture that incorporates a 12-bit ADC at the pixel level. The CTIA pixel input circuitry has two gain modes with programmable full-well capacity values of 100K e- and 500K e-. The DROIC has been developed with a system-on-chip architecture in mind, where all the timing and biasing are generated internally without requiring any critical external inputs. The chip is configurable with many parameters programmable through a serial programmable interface (SPI). It features a global shutter, low power, and high frame rates programmable from 30 up 500 frames per second in full VGA format supported through 24 LVDS outputs. This DROIC, suitable for hybridization with focal plane arrays (FPA) is ideal for high-performance uncooled camera applications ranging from near IR (NIR) and shortwave IR (SWIR) to mid-wave IR (MWIR) and long-wave IR (LWIR) spectral bands.
高性能数字读出集成电路(DROIC)用于红外成像
Banpil Photonics开发了一种高性能数字读出集成电路(DROIC),用于针对各种军事,工业和商业红外(IR)成像应用的图像传感器和相机系统。像素输出的片上数字化消除了外部模数转换器(ADC)的必要性,这不仅降低了成本,而且还实现了封装小型化,以实现SWaP-C相机系统。此外,DROIC提供了更高的片上处理智能的新机会,这在当今流行的传统模拟roic中是不可能的。传统的roic通常只能增强一种高性能属性,如帧率、功耗或噪声水平,在同时满足当今成像应用中最苛刻的性能要求时就会失败。此外,缩放模拟读出电路以满足此类要求会导致昂贵,高功耗的大型复杂系统,这在SWaP-C趋势中是站不住脚的。我们提出了一种VGA格式(640x512像素15μm间距)电容跨阻放大器(CTIA) DROIC架构的实现,该架构在像素级集成了一个12位ADC。CTIA像素输入电路具有两种增益模式,可编程全井容量值分别为100K e-和500K e-。DROIC在开发时考虑了系统芯片架构,所有的时序和偏置都是在内部生成的,不需要任何关键的外部输入。该芯片可通过串行可编程接口(SPI)配置许多参数。它具有全局快门,低功耗和高帧率,可编程从每秒30帧到500帧,通过24个LVDS输出支持全VGA格式。该DROIC适合与焦平面阵列(FPA)杂交,是近红外(NIR)和短波红外(SWIR)到中波红外(MWIR)和长波红外(LWIR)光谱带的高性能非冷却相机应用的理想选择。
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