60 GHz-band modules for multi beam wireless broadband communication system

K. Kawakami, Y. Kitsukawa, S. Miho, K. Mori, T. Yuasa, M. Hieda, M. Miyazaki
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引用次数: 0

Abstract

This paper describes a 60 GHz-band MMIC chipset which consists of amplifiers, mixer, and switch, and two modules integrated on multi-layer LTCC substrates for multi beam access point of the wireless broadband communication systems. We are studying the “multi beam” access-point to provide the high speed, secure, and effective wireless link to the wide cover area. To reduce the out-of-band spurious, the modules employ the low spurious and band-limited circuits, which are the low spurious quadruple harmonic image rejection mixer, the power amplifier with the short stubs using series-connected metalinsulator-metal capacitors, and the switch using FET resonators. Therefore the modules are achieved low spurious characteristics. Each fabricated MMIC and module demonstrates with good functionality.
用于多波束无线宽带通信系统的60 ghz频段模块
本文介绍了一种60 ghz频段的MMIC芯片组,该芯片组由放大器、混频器和开关以及集成在多层LTCC基板上的两个模块组成,用于无线宽带通信系统的多波束接入点。我们正在研究“多波束”接入点,为大覆盖区域提供高速、安全、有效的无线链路。为了减少带外杂散,该模块采用低杂散和带限电路,即低杂散四倍谐波消像混频器,功率放大器短存根采用串联金属绝缘体-金属电容器,开关使用FET谐振器。因此,该模块实现了低杂散特性。所制作的MMIC和模块均具有良好的功能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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