Investigation of technological operations for manufacturing 3D micro-assemblies with embedded elements

Abstract

The internal mounting technology is the mounting of open-dies in a functional radio-electronic module substrate structure. This method does not require the microcircuits packaging, since the package task carry out the microelectronic product substrate. As a working surface for a microelectronic product today we have a huge selection of materials. For example, to produce flexible boards, polymer materials such as polyimides are actively used. That material is characterized by wide regulation possibilities of composition, structure and properties. The internal mounting technology implies the open-dies embedding into the polymer material, followed by etching to the open-die contact pad (CP), and the added ability to integrate 3D design will significantly improve the technology in many parameters. In addition, flexible materials allow the development of complex-shaped micro-assemblies, which is one of the important advantages in a powerful products development and their subsequent installation in hard-to-reach spots.