Broadband transimpedance amplifier TIA in CMOS 0.18μm technology using matching technique

Jawdat Y. Abu-Taha, M. Yazgi
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Abstract

This paper describes the matching technique to improve the bandwidth of multi-GHz frequency ranges for the transimpedance amplifier (TIA). Different topologies can be used to implement the input matching network. It is shown that by simultaneously using of series input matching topology and T-output matching network, the bandwidth of the TIA can be obviously improved. This methodology is supported by a design example in a 0.18μm CMOS technology. Cadence tools simulation results show a -3dB bandwidth of 20GHz with 50fF photodiode capacitance, a transimpedance gain of 52.6dBΩ, 8.7pA/√Hz input referred noise and group delay less than 3ps. The TIA dissipates 1.3mW from a 1.8 V supply voltage.
宽带跨阻放大器TIA在CMOS 0.18μm技术中采用匹配技术
介绍了提高跨阻放大器(TIA)多ghz频段带宽的匹配技术。可以使用不同的拓扑来实现输入匹配网络。结果表明,同时采用串联输入匹配拓扑和t -输出匹配网络,可以明显提高TIA的带宽。该方法以0.18μm CMOS工艺为例进行了验证。Cadence工具仿真结果表明,-3dB带宽为20GHz,光电二极管电容为50fF,跨阻增益为52.6dBΩ,输入参考噪声为8.7pA/√Hz,群延迟小于3ps。TIA在1.8 V电源电压下耗散1.3mW。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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