{"title":"Technologies for high performance CMOS active pixel imaging system-on-a-chip","authors":"M. Chi","doi":"10.1109/ICSICT.1998.785847","DOIUrl":null,"url":null,"abstract":"Active pixel sensors (APS) based on CMOS technology challenges CCD image sensors in many aspects for high performance imaging systems, such as, low-voltage operation, low-power consumption, random image access, highly integrated functionality, high resolution, fast readout, CMOS compatible fabrication and low cost. In this paper various active CMOS pixel designs and circuit components for high performance imaging systems are reviewed. The emerging CMOS technologies for integrating all these components into camera-on-a-chip are reviewed.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"24 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.1998.785847","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Active pixel sensors (APS) based on CMOS technology challenges CCD image sensors in many aspects for high performance imaging systems, such as, low-voltage operation, low-power consumption, random image access, highly integrated functionality, high resolution, fast readout, CMOS compatible fabrication and low cost. In this paper various active CMOS pixel designs and circuit components for high performance imaging systems are reviewed. The emerging CMOS technologies for integrating all these components into camera-on-a-chip are reviewed.