Methodology used for the development of an electrostatic discharge (ESD) sensitivity classification for packaging and handling of automotive components
{"title":"Methodology used for the development of an electrostatic discharge (ESD) sensitivity classification for packaging and handling of automotive components","authors":"K. K. Katrak","doi":"10.1109/ISEMC.1994.385651","DOIUrl":null,"url":null,"abstract":"Electrostatic discharge (ESD) is an increasing threat of electrical overstress damage, in both discrete electronic devices and integrated circuits of electronic components. A test procedure for evaluating electronic components in the powered state was already available. A test procedure for evaluating the ESD sensitivity of components for handling and packaging was also available, but real world results showed it to be deficient. Consequently, there was a definite need to develop a test procedure that correlated to real world results. The paper describes the development of a test method that evaluates the ESD sensitivity of components and simulates realistic handling and packaging conditions.<<ETX>>","PeriodicalId":154914,"journal":{"name":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","volume":"26 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1994.385651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Electrostatic discharge (ESD) is an increasing threat of electrical overstress damage, in both discrete electronic devices and integrated circuits of electronic components. A test procedure for evaluating electronic components in the powered state was already available. A test procedure for evaluating the ESD sensitivity of components for handling and packaging was also available, but real world results showed it to be deficient. Consequently, there was a definite need to develop a test procedure that correlated to real world results. The paper describes the development of a test method that evaluates the ESD sensitivity of components and simulates realistic handling and packaging conditions.<>