Failure Analysis of a Full Wave Phase Sensitive Demodulator Induced by Surface Defect

Pengfei Lian, Zebin Kong, Sheng Hu, Rong Zhao, Qing Ji, Jianshe Lou, Kunshu Wang, L. Tang
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Abstract

This paper focus on failure analysis of a full wave phase sensitive demodulator induced by surface defect. A phase sensitive demodulator fails, inducing a big AC signal after the post-amplifier. According to the failure analysis, the failure reason of the phase sensitive demodulator is the surface defect in the interface of the Si and the SiO2. The surface defect decreases the current of the operational amplifier of the phase sensitive demodulator, making the signal suppression of the low frequency noise worse. The failure reappearance is performed by adding a parallel resistance between the power supply and the base of the triode of the operational amplifier. Moreover, three improvement measurements that include electrical test, cleaning and process are proposed, solving the failure phenomenon of the full wave phase sensitive demodulator.
全波相敏解调器表面缺陷失效分析
对一种全波相敏解调器的表面缺陷失效进行了分析。一个相敏解调器失效,后置放大器后产生一个大的交流信号。根据失效分析,相敏解调器的失效原因是Si和SiO2界面的表面缺陷。表面缺陷使相敏解调器运算放大器的电流减小,使低频噪声的信号抑制变差。故障再现是通过在电源和运算放大器三极管的基极之间增加一个并联电阻来实现的。提出了电气试验、清洗和工艺改进措施,解决了全波相敏解调器的失效现象。
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