EMC Focused Half-Bridge Characterization and Modeling

Julian Dobusch, Philipp Konarski, D. Kuebrich, T. Duerbaum
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引用次数: 2

Abstract

Power electronic circuits are a major source of Electromagnetic Compatibility (EMC) problems. The increased switching speed of modern semiconductor devises based on Silicon Carbide (SiC) and Gallium Nitride (GaN) further aggravates this issue. Thus, the importance of including EMC aspects in the design phase of a power electronic circuit is high and a reliable simulation model is very useful for rapid circuit testing and identification of the source of interference. However, the influence of parasitic components represents a crucial part of the coupling paths and thus has to be considered. This paper covers the development of a highly accurate simulation model including these parasitics. A major concern is the measurement of coupling capacitances which form an essential contribution to the model.
EMC半桥特性与建模
电力电子电路是电磁兼容性(EMC)问题的主要来源。基于碳化硅(SiC)和氮化镓(GaN)的现代半导体器件开关速度的提高进一步加剧了这一问题。因此,在电力电子电路的设计阶段考虑电磁兼容方面是非常重要的,一个可靠的仿真模型对于快速测试电路和识别干扰源是非常有用的。然而,寄生组件的影响是耦合路径的关键部分,因此必须加以考虑。本文介绍了包括这些寄生在内的高精度仿真模型的开发。一个主要的问题是耦合电容的测量,这是对模型的重要贡献。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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