{"title":"RIE of the polyimide micromechanical structures","authors":"L. Matay, I. Kostic, P. Hrkut, R. Andok","doi":"10.1109/ASDAM.2000.889547","DOIUrl":null,"url":null,"abstract":"Polyimides are commercially available materials which are widely used in various aspects of microelectronics. In this work, we show the use of a polyimide as a material suitable for the formation of micromechanical structures and its modification by reactive ion etching.","PeriodicalId":303962,"journal":{"name":"ASDAM 2000. Conference Proceedings. Third International EuroConference on Advanced Semiconductor Devices and Microsystems (Cat. No.00EX386)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ASDAM 2000. Conference Proceedings. Third International EuroConference on Advanced Semiconductor Devices and Microsystems (Cat. No.00EX386)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM.2000.889547","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Polyimides are commercially available materials which are widely used in various aspects of microelectronics. In this work, we show the use of a polyimide as a material suitable for the formation of micromechanical structures and its modification by reactive ion etching.