RIE of the polyimide micromechanical structures

L. Matay, I. Kostic, P. Hrkut, R. Andok
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引用次数: 3

Abstract

Polyimides are commercially available materials which are widely used in various aspects of microelectronics. In this work, we show the use of a polyimide as a material suitable for the formation of micromechanical structures and its modification by reactive ion etching.
聚酰亚胺微机械结构的RIE
聚酰亚胺是一种市售材料,广泛应用于微电子的各个方面。在这项工作中,我们展示了聚酰亚胺作为一种适合形成微机械结构的材料,并通过反应离子蚀刻对其进行改性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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