Development of an analog and mixed-signal read-out circuit for long-wavelength infrared focal-plane arrays

M. Claro, A. Quivy
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Abstract

We designed, fabricated and tested two prototypes of read-out circuit arquitectures using a 0.18um standard CMOS technology aiming the fabrication of focal-plane arrays (FPAs) for applications to infrared imaging. One small capacitive transimpedance amplifier (CTIA) was designed for high-resolution analog FPAs, as well as a novel mixed-signal architecture which has several advantages over the analog design, such as a wider dynamic range, a native digital output, a longer integration time and a faster system development. The read-out circuits were electrically tested at room temperature and liquid-nitrogen temperature (77 K) and, later, were connected to a photovoltaic quantum-well infrared photodetector cooled at 10K to check the properties of the whole system. The CTIA performed as expected. The mixed-signal circuit appeared to be able to measure currents from pA to nA with a good linearity and low noise. The calculated resolution was about 50,000 e-/bit, and integration times from milliseconds to a few seconds could be reached without any saturation. The results confirm that such circuits can be used for the design of state-of-the-art intersubband FPAs with very few modifications.
长波长红外焦平面阵列模拟和混合信号读出电路的研制
我们使用0.18um标准CMOS技术设计、制造和测试了两个读出电路架构原型,旨在制造用于红外成像的焦平面阵列(fpa)。设计了一种用于高分辨率模拟fpga的小型电容跨阻放大器(CTIA),以及一种新颖的混合信号架构,该架构具有比模拟设计更宽的动态范围、原生数字输出、更长的集成时间和更快的系统开发速度等优点。读出电路在室温和液氮温度(77 K)下进行电气测试,然后连接到10K冷却的光伏量子阱红外光电探测器上,以检查整个系统的性能。CTIA的表现符合预期。混合信号电路似乎能够测量从pA到nA的电流,具有良好的线性和低噪声。计算的分辨率约为50,000 e-/bit,积分时间从毫秒到几秒不等,没有任何饱和。结果证实,这种电路可以用于设计最先进的子带间fpga,修改很少。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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