Self-localization of degradation process in pre-breakdown stage of thin SiO/sub 2/ films: new model and experimental procedure

A. Kotov
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Abstract

We further consider the model for the degradation chain of thin SiO/sub 2/ films, which includes four stages: 1) generation of deep traps/negative space charge /spl rArr/; 2) self-localization of injection current /spl rArr/; 3) formation of local defect spot /spl rArr/; 4) appearance of leakage channel and its development into the breakdown region. A generation of space charge during stages 1 and 2 leads to the high local accumulation of energy in the polarized dielectric medium. The chaotic destabilization events between 2 and 3 stages (rapid detrapping/spl hArr/restoration of space charge) release this energy via strong mechanical relaxation and, as a consequence, form a leakage channel (area less than 10/sup -11/ cm/sup 2/). Thus, the second stage of degradation chain-SLDP (self-localization of degradation process)-plays a crucial role in oxide reliability. The main result of this work-SLDP Model, allowing to explain non-linear decrease of substrate hole current (DSHC effect), which was observed in small MOS structures, subjected to stresses caused by electron injection. It is also shown that the most popular degradation/breakdown models are inapplicable for interpretation of DSHC effect. The presence of local SiO/sub 2/ regions, resistant to the negative space charge formation (endurance up to 10/sup 4/ A/cm/sup 2/ and 10/sup 4/ Cl/cm/sup 2/), allows us to explain a positive feedback of SLDP. Temperature analysis strongly supports new degradation/breakdown model and models which involve hydrogen related effects in oxide films under the field/temperature stress.
SiO/ sub2 /薄膜预击穿阶段降解过程的自定位:新模型和实验方法
我们进一步考虑了SiO/ sub2 /薄膜的降解链模型,该模型包括四个阶段:1)产生深阱/负空间电荷/spl rArr/;2)注入电流/spl rArr/自定位;3)局部缺陷点/spl rArr/的形成;4)泄漏通道的出现及其向击穿区域的发展。在第1和第2阶段产生的空间电荷导致极化介质中能量的高局部积累。2和3阶段之间的混沌不稳定事件(快速脱陷/spl hArr/空间电荷恢复)通过强机械松弛释放该能量,并因此形成泄漏通道(面积小于10/sup -11/ cm/sup 2/)。因此,降解链的第二阶段- sldp(降解过程的自定位)-在氧化物可靠性中起着至关重要的作用。该工作- sldp模型的主要结果,允许解释在电子注入引起的应力下,在小型MOS结构中观察到的衬底空穴电流(DSHC效应)的非线性减少。研究还表明,最流行的降解/击穿模型并不适用于DSHC效应的解释。局部SiO/ sub2 /区域的存在,抵抗负空间电荷的形成(持续时间高达10/sup 4/ A/cm/sup 2/和10/sup 4/ Cl/cm/sup 2/),使我们能够解释SLDP的正反馈。温度分析有力地支持了新的降解/击穿模型以及在场/温度应力下氧化膜中涉及氢相关效应的模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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