W. Ko, M. Song, Ki-Nam Kim, Jun-Ho Byun, Do-Yeon Lee, Eun-gi Kim, Eun-A Koo, So-Yeon Kwon, Geun-Ho Kim, Dong-Hyeuk Choi, Ga-Won Lee
{"title":"Performance Improvement of ZnO Based ReRAM with SiCN Oxygen Reservoir","authors":"W. Ko, M. Song, Ki-Nam Kim, Jun-Ho Byun, Do-Yeon Lee, Eun-gi Kim, Eun-A Koo, So-Yeon Kwon, Geun-Ho Kim, Dong-Hyeuk Choi, Ga-Won Lee","doi":"10.1109/EDTM55494.2023.10103094","DOIUrl":null,"url":null,"abstract":"In this paper, a new structure of ZnO based ReRAM with SiCN capping layer is suggested as oxygen reservoir to improve the device performances. The fabricated devices show lower set/reset voltage and stable current, compared to the device without SiCN layer. XRD spectrum show it not a crystallization effect. Based on the XPS analysis results, SiCN layer seems to be a great oxygen blocking layer preventing the metal electrode from bonding with oxygen ion.","PeriodicalId":418413,"journal":{"name":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTM55494.2023.10103094","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper, a new structure of ZnO based ReRAM with SiCN capping layer is suggested as oxygen reservoir to improve the device performances. The fabricated devices show lower set/reset voltage and stable current, compared to the device without SiCN layer. XRD spectrum show it not a crystallization effect. Based on the XPS analysis results, SiCN layer seems to be a great oxygen blocking layer preventing the metal electrode from bonding with oxygen ion.