A. Deutsch, H. Smith, G. Kopcsay, D. Edelstein, P. Coteus
{"title":"On-chip wiring design challenges for GHz operation","authors":"A. Deutsch, H. Smith, G. Kopcsay, D. Edelstein, P. Coteus","doi":"10.1109/EPEP.1999.819190","DOIUrl":null,"url":null,"abstract":"This presentation reviews current on-chip wiring design practices and the fundamental properties of on-chip lossy transmission lines. The deficiencies of RC-circuit representation are highlighted and it is shown that many of the modeling and simulation techniques developed for package interconnections must be adopted by microprocessor designers in order to achieve GHz clock rates.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
This presentation reviews current on-chip wiring design practices and the fundamental properties of on-chip lossy transmission lines. The deficiencies of RC-circuit representation are highlighted and it is shown that many of the modeling and simulation techniques developed for package interconnections must be adopted by microprocessor designers in order to achieve GHz clock rates.