An approach to thermal analysis of PCB with components having cyclic electrical loading

R.S. Li, S. E. Larson
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引用次数: 5

Abstract

Thermal transient analysis of an electronic packaging system is often cumbersome, even with today's sophisticated numerical software. This paper presents an efficient numerical approach to thermal transient analysis of an electronic packaging,system under electrical cyclic loading conditions. A numerical solution of temperature as function of time is formulated upon which a simple computer code is written to obtain transient behavior of a system or components. Based on the lumped capacitance (LC) model, a general average power concept is presented to obtain a steady state solution from finite element modeling (FEM). The steady state solution is then used to evaluate the time constant for analysis of transient heat transfer. The transient solutions from the proposed model and those obtained from FEA show good agreement at component level. Time to transient solution of a wire resistor only takes a couple of seconds via the proposed approach while it took four hours on HP735 for the first 120 cycles. The proposed approach is demonstrated through an example of an automotive control module PCB with resistors having cyclic current input. Thermal measurements from an IR scanner are also presented to correlate with analytical results.
具有循环电负荷元件的PCB热分析方法
电子封装系统的热瞬态分析通常是繁琐的,即使有今天复杂的数值软件。本文提出了一种有效的电子封装系统在电气循环载荷条件下热瞬态分析的数值方法。给出了温度随时间的函数的数值解,在此基础上编写了简单的计算机代码,以获得系统或部件的瞬态行为。在集总电容(LC)模型的基础上,提出了一般平均功率的概念,通过有限元建模(FEM)得到稳态解。然后用稳态解计算时间常数,用于瞬态传热分析。该模型的暂态解与有限元分析的暂态解在构件水平上具有较好的一致性。通过所提出的方法,线电阻的瞬态解决时间只需要几秒钟,而在HP735上,前120个周期需要4个小时。通过一个具有循环电流输入电阻的汽车控制模块PCB示例来演示所提出的方法。热测量从红外扫描仪也提出了与分析结果相关联。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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