Rate-Determining Factor of Aluminum Corrosion and a Rapid Method of Assessing the Moisture Resistance of Plastic Encapsulated LSI

Abstract

New information about the aluminum corrosion of plastic encapsuled LSI was derived from measuring the leakage current on the die surface. Aluminum corrosion at temperature/humidity tests depends upon the water film produced at the interface between the molding resin and die. The moisture resistance of plastic encapsulated LSI can be rapidly evaluated by electrical leakage which can be related to water film formation.