Experimental Demonstration of Point-Injection Trench IGBT Concept

Elizabeth Buitrago, M. Antoniou, Nick Schneider, E. Bianda, Luca De-Michielis, C. Corvasce, F. Udrea
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Abstract

The point injection trench IGBT is a promising concept based on the narrowing of the mesa between active gate trenches. In this paper, multiple design variations of the point injection trench IGBT with a voltage rating of 1200 V are fabricated and experimentally investigated. It is shown that sub micron mesa widths are successfully processed and a broad design space of IGBT devices with competitive performance is spanned.
点注入沟槽IGBT概念的实验论证
点注入沟槽IGBT是一个很有前途的概念,它基于有源栅极沟槽之间的平台变窄。本文制作了额定电压为1200v的点注入沟槽IGBT的多种设计方案,并进行了实验研究。结果表明,该方法成功地加工了亚微米台面宽度,为具有竞争性能的IGBT器件提供了广阔的设计空间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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