Parallel overloaded CDMA interconnect (OCI) bus architecture for on-chip communications

K. E. Ahmed, Mohammed M. Farag
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引用次数: 3

Abstract

On-chip interconnects are the performance bottleneck in modern System-on-Chips (SoCs). Bus topologies and Networks-on-Chip (NoCs) are the main approaches used to implement on-chip communication. The interconnect fabric enables resource sharing by Time and/or Space Division Multiple Access (T/SDMA) techniques. Code Division Multiple Access (CDMA) has been proposed to enable resource sharing in on-chip interconnects where each data bit is spread by a unique orthogonal spreading code of length N. Unlike T/SDMA, in wireless CDMA, the communication channel capacity can be increased by overcoming the Multiple Access Interference (MAI) problem. In response, we present two overload CDMA interconnect (OCI) bus architectures, namely TDMA-OCI (T-OCI) and Parallel-OCI (P-OCI) to increase the classical CDMA interconnect capacity. We implement and validate the T-OCI and P-OCI bus topologies on the Xilinx Artix-7 AC701 kit. We compare the basic SDMA, TDMA, and CDMA buses and evaluate the OCI buses in terms of the resource utilization and bus bandwidth. The results show that the T-OCI achieve 100% higher bus capacity, 31% less resource utilization compared to the conventional CDMA bus topology. The P-OCI bus provides N times higher bus bandwidth compared to the T-OCI bus at the expense of increased resource utilization.
片上通信的并行过载CDMA互连(OCI)总线结构
片上互连是现代片上系统(soc)的性能瓶颈。总线拓扑和片上网络(noc)是实现片上通信的主要方法。互连结构通过时间和/或空分多址(T/SDMA)技术实现资源共享。为了实现片上互连的资源共享,提出了码分多址(CDMA)技术,其中每个数据位通过长度为n的唯一正交扩展码进行传播,与T/SDMA不同,在无线CDMA中,可以通过克服多址干扰(MAI)问题来增加通信信道容量。为此,我们提出了TDMA-OCI (T-OCI)和并行OCI (P-OCI)两种过载CDMA互连总线架构,以提高经典CDMA互连容量。我们在赛灵思Artix-7 AC701套件上实现并验证了T-OCI和P-OCI总线拓扑。我们比较了基本的SDMA、TDMA和CDMA总线,并从资源利用率和总线带宽方面评估了OCI总线。结果表明,与传统的CDMA总线拓扑相比,T-OCI实现了100%的总线容量提升,31%的资源利用率降低。P-OCI总线提供比T-OCI总线高N倍的总线带宽,但代价是增加资源利用率。
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