Net and pin distribution for 3D package global routing

Abstract

In this paper, we study the net and pin distribution problem for global routing targeting three dimensional packaging layout via system-on-package (SOP). The routing environment for the new emerging mixed-signal SOP technology is more advanced than that of the conventional PCB or MCM technology - pins are located at all layers of SOP packaging substrate rather than the top-most layer only. This is the first work to formulate and solve the multi-layer net and pin distribution for layer, wirelength, and crosstalk minimization.